Engineering, Production & Testing
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Nov 12, 2010
Advanced LED Processing Technologies for C-Plane Sapphire Substrates Enable 50% Reduction in Polishing Time
PETER WOLTERS is introducing to the LED market a new polishing slurry that has demonstrated a 50% reduction in the time required to complete final polishing for flip chip or through substrate LED’s (see figure 1). This development utilizes a combination of chemical and abrasive technologies to decrease the cost of ownership or the manufacturing cost of the LED when manufactured on C-plane sapphire. “As demonstrated by our testing, the time required to achieve a comparable final surface finish has been reduced by half in substrates of identical incoming quality”, said David Suica, President of Peter Wolters of America, the PETER WOLTERS Competence Center for Sapphire Polishing.
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Dec 02, 2010
Labsphere Launches High Speed LED Characterization Spectrometers
Designed for a full range of LED characterization measurements, Labsphere (www.labsphere.com) has introduced the CDS-5400 and CDS-9800 High Speed LED Spectrometers. Both models offer reliability, speed and accuracy with a choice of spectral range to suit specification application needs.
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Dec 09, 2010
Monocrystal Introduces 10-inch Sapphire Substrate to Expand LED Industry Prospects
Monocrystal, a leading manufacturer of electronic materials for LED and solar industries, announced today availability of the company’s innovative ultra-large 10-inch C-plane epi-ready sapphire substrate.
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Dec 09, 2010
Essemtec Introduces New LED Manufacturing and Assembly Technologies Product
Essemtec announces that it will highlight Pantera-XV at the upcoming LED EXPO, taking place in New Delhi, India, from December 17-19, 2010. Pantera-XV is a highly versatile, Swiss-quality pick-and-place, suitable for LED, standard SMD placement and dispensing. High-quality dispensing valves from Vermes also will be featured.
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Dec 16, 2010
Philips Lumileds Leads LED Industry with Mass Production on 150 mm Wafers
Philips Lumileds is the first power LED manufacturer in mass production on 150 mm wafers and is now producing millions of GaN based LEDs weekly on the larger substrates. Lumileds has the most advanced LED manufacturing and operations environment and capability in the world. The company continues to lead the industry in never before possible lumen-per-dollar and lumen-per-watt performance in lighting applications and in the drive to increased adoption of solid-state lighting solutions.
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Jan 21, 2011
KLA-Tencor Launches New Inspection and Analysis Systems: CANDELA® 8620 HB-LED Inspection System, ICOS® WI-2220 LED Wafer Inspector & KLARITY® LED Defect Analysis System
Today, KLA-Tencor Corporation (NASDAQ: KLAC), the world’s leading supplier of process control and yield management solutions for the semiconductor and related industries, introduced its new Candela® 8620 substrate and epitaxy (epi) wafer inspection system. In addition, KLA-Tencor introduces broad portfolio of process control solutions designed to improve productivity of LED device fabs. KLARITY LED offers automated defect analysis for LED yield enhancement and rapid time to results, while ICOS WI-2220 provides low cost of ownership to support LED industry cost per lumen goals.
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Jan 26, 2011
New 12-Inch Sapphire Wafers for High Quality Lighting and Consumer Electronics Industries
Rubicon Technology, Inc., a leading provider of sapphire substrates and products to the LED, RFIC, Semiconductor, and Optical industries, today announced the production of 12-inch polished wafers, the largest high-quality, sapphire wafer ready for production of LEDs (light emitting diodes). Rubicon now offers a complete range of high quality sapphire substrates including two-, three- and four- inch core, and six-, eight- and 12-inch wafers.
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Jan 27, 2011
Major Milestone Passed with Photonic Crystal Patterning on Full 4” Wafers
Eulitha AG of Switzerland and Dai Nippon Printing Co., Ltd. (DNP) of Japan announced the successful patterning of 4” wafers with Eulitha’s proprietary PHABLE technology. Photonic crystal patterns with 600 nm period and hexagonal symmetry was created uniformly over 4” wafers.
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Feb 09, 2011
Veeco Introduces MaxBright MOCVD Multi-Reactor System
Veeco Instruments Inc. announced today the introduction of the TurboDisc(R) MaxBright(TM) Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) Multi-Reactor System for production of high-brightness light-emitting diodes (HB LEDs). MaxBright has already been accepted by a leading LED manufacturer and Veeco is currently shipping MaxBright systems to additional top manufacturers in Korea, Taiwan and China.
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Feb 10, 2011
Tower Automatic Storage System Increases the Flexibility of Production
Variosystems, the international electronics manufacturing subcontractor, manages thousands of components for its customers and assembly jobs. Until recently the component storage has required big efforts. Today, the Tower automatic storage system from Essemtec simplifies logistics and increases the flexibility of the production. Component reels and trays can now be stored locally in production.
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Feb 15, 2011
Europlacer Launches Dual Head iineo-II VLB for Growing LED Assembly Market
Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, debuts the iineo-II VLB. The dual-head iineo-II VLB is the latest enhancement to the Europlacer product portfolio, designed for the growing LED assembly segment.
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Feb 16, 2011
Labsphere Introduces New LED Measurement Systems
Labsphere announces its new XSLMS series light measurement systems which features extended dynamic range for different wavelength ranges and a broad variety of interchangeable light measurement accessories. NIST traceable total spectral flux standards enable simple in-house system recalibration and verification of the system. Spheres with diameters from 10 inch to 3m with a nearly perfect Lambertian reflection of 98% are available.
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Feb 18, 2011
Leading Global LED Manufacturers Advance into Land of 8-inch Sapphire Substrate
Monocrystal, a leading manufacturer of electronic materials for LED and solar industries, announced today shipment of its premium 8-inch C-plane epi-ready sapphire substrates to one of the world’s leading LED manufacturers.
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Feb 23, 2011
EV Group Expands Portfolio of Products to Address Fast-Growing HB-LED Market With Launch of EVG620HBL Mask Alignment System
EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, announced the latest addition to its portfolio of products created to optimize the manufacture of high-brightness light-emitting diodes (HB-LEDs), compound semiconductors and power electronics. The new EVG620HBL fully automated mask alignment system builds on EVG's field-proven mask aligner platform, adding a high-intensity ultraviolet (UV) light source and five cassette stations – significantly more than competitive offerings – to enable continuous fabrication of devices. As a result, the EVG620HBL delivers unparalleled throughput of up to 165 six-inch wafers per hour (up to 220 wafers per hour in first print mode) with the industry's highest alignment accuracy and yield.
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Feb 24, 2011
Juki Debuts JX-200LED High Speed Placement System for LED Applications
Juki Corporation, a world-leading provider of automated assembly products and systems, introduces the JX-200LED for the LED assembly market.
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Mar 03, 2011
Nordson ASYMTEK Fluid Dispensers Jet Precisely into Narrow Cavities To Improve Side-View LED Manufacturing Process
Nordson ASYMTEK, a leader in dispensing, coating, and jetting technologies, introduces jet dispensing for manufacturing side-view LEDs. The system jets 0.1 to 0.2 mm dots through windows as small as 0.4 mm into the LED cavities. Side-view LEDs illuminate the displays in devices such as tablet computers, smart phones, and e-readers. Nordson ASYMTEK's Spectrum™ S-920N jetting system automatically maintains a consistent shot weight with software-managed dispense parameters. Closed-loop dispensing eliminates the need for time-consuming operator adjustment. Unlike other multi-headed needle dispensing systems, Nordson ASYMTEK's system is easier to set up and maintain in production, keeping your process under machine control.
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Mar 30, 2011
Thermal Technology Provides New Developed K1 Sapphire Growers to Silian
Thermal Technology, a leading manufacturer of crystal growth equipment and high temperature furnace systems, recently finalized a sales agreement with Chongqing Silian Optoelectronics Science & Technology Co., Ltd. (Silian) for multiple Model K1 sapphire crystal growers.
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Mar 31, 2011
Christopher Associates and Shoda Techtron Enter LED Lighting Market with New Substrate Coating Technology
Christopher Associates Inc. announces a new solution for coating and sealing the edges of aluminum core LED panels. The UVP-630A edge coating system was developed by Shoda Techtron to automatically coat and cure chemically resistant coatings, protecting and sealing the substrate as it is processed through multiple steps.
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Apr 01, 2011
Essemtec Builds Production Line for LED Tubular Lamp
Until recently LED TL-tubes, a replacement for fluorescent lamps, had to be manufactured in a lavish modular design. In the future, using the new LED assembly line with a large-area printer from Essemtec, PCBs for such lamps can be manufactured fully automatically in a single, cost-efficient production run.
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Apr 28, 2011
New Automation Platform Delivers Uninterrupted LED Production
J P Sercel Associates (JPSA), a world leader in innovative laser micromachining systems and automation technology, announces worldwide shipments of its new Integrated Automation Platform (IAP) to semiconductor and LED manufacturers. The IAP is a high volume production robot dedicated to providing uninterrupted processing of wafers, which lowers LED manufacturing costs.
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